
230 Tie Point Mini Solderless Breadboard, Unmounted
Additional Notes:
* 230 tie point solderless breadboard with 2 distribution strips.
* Features: ABS plastic body, Nickel plated contacts Rated 2A Max.
* Contact resistance less than 1 milliohm @ 1kHz.
* Tested for over 10,000 cycles.
* Interlocking edges for combining multiple boards.
* Suitable for 19-29 AWG wire and all DIP size components.
* Dimensions (LxWxH): 3-1/4" x 2-1/8" x 3/8"
MPJA
18862 TE
- CodistoAmazon:
- 0.0000